Prototype e hatisitsoeng liboto tsa potoloho RED solder maske likoti tse castellated
Tlhaloso ea Sehlahisoa:
| Boitsebiso ba Motheo: | FR4 TG140 |
| Botenya ba PCB: | 1.0+/-10% limilimithara |
| Palo ea Lera: | 4L |
| Botenya ba Koporo: | 1/1/1/1 oz |
| Phekolo ea sefahleho: | ENIG 2U” |
| Mask ea solder: | Bofubelu bo benyang |
| Silkscreen: | Bosoeu |
| Ts'ebetso e khethehileng: | Pth halofo ea masoba mathōkong |
Kopo
Mekhoa ea ho etsa li-half holes tse petelitsoeng ke:
1. Etsa lesoba le lehlakoreng le halofo ka sesebelisoa sa ho itšeha habeli se nang le sebopeho sa V.
2. Boro ea bobeli e eketsa masoba lehlakoreng la lesoba, e tlosa letlalo la koporo esale pele, e fokotsa li-burrs, 'me e sebelisa li-groove cutters ho e-na le li-drill ho ntlafatsa lebelo le ho theoha.
3. Kenya koporo ho electroplate substrate, e le hore lera la koporo e electroplated leboteng lesoba lesoba le chitja ka bohale ba boto.
4. Tlhahiso ea potoloho e ka ntle ea lera ka mor'a ho lamination, ho pepeseha, le ntshetsopele ea substrate ka tatellano, substrate e tlas'a plating bobeli koporo le tin plating, e le hore lera koporo leboteng lesoba lesoba le chitja ka bohale ba. boto e teteaneng 'me lesela la koporo le koahetsoe ke lesela la thini bakeng sa ho hanyetsa kutu;
5. Ho etsa halofo ea lesoba ho khaola lesoba le pota-potileng moeling oa boto ka halofo ho etsa lesoba la halofo;
6. Mohato oa ho tlosa filimi, filimi e khahlanong le electroplating e hatelitsoeng nakong ea ts'ebetso ea ho hatisa filimi e tlosoa;
7. Etching substrate e ngotsoe, 'me koporo e pepeneneng holim'a lera le ka ntle la substrate e tlosoa ka ho etching;
8. Letlapa le hlobolang substrate le ntšoa ka thini, e le hore lesela le leboteng la lesoba le ka tlosoa, 'me lera la koporo leboteng la lesoba la halofo le pepesitsoe.
9. Ka mor'a ho theha, sebelisa tepi e khubelu ho khomarela liboto tsa lihlopha hammoho, 'me u tlose li-burrs ka mohala oa alkaline etching.
10. Ka mor'a ho roala ha koporo ea bobeli le tin holim'a substrate, lesoba le pota-potileng moeling oa boto le khaoloa ka halofo ho etsa lesoba la halofo, hobane lera la koporo la lebota la lesoba le koahetsoe ke lesela la thini, 'me lera koporo ea lerako lesoba ka ho feletseng le lera koporo ea lera e ka ntle ea substrate Connection, e akarelletsang matla bonding matla, ka ka katleho thibela lera koporo leboteng lesoba ho tloha ho huloa tima kapa koporo warping ha seha;
11. Ka mor'a ho etsa halofo ea lesoba ho phethoa, filimi e tlosoa ebe e kenngoa, e le hore bokaholimo ba koporo bo se ke ba e-ba le oxidized, ka katleho ho qoba ho hlaha ha koporo e setseng kapa esita le potoloho e khutšoanyane, le ho ntlafatsa tekanyo ea lihlahisoa tsa halofo ea metallized. -sekoti PCB potoloho boto.
FAQs
Sekoti se entsoeng ka halofo kapa sekontiri se entsoeng ka setempe, ke moeli o bōpehileng joaloka setempe ka ho seha ka halofo holim'a kemiso.Plated half-hole ke boemo bo holimo ba mathōko a petelitsoeng bakeng sa liboto tsa potoloho tse hatisitsoeng, tseo hangata li sebelisetsoang likhokahano tsa boto ho ea ho boto.
Via e sebelisoa e le khokahanyo pakeng tsa likarolo tsa koporo ho PCB ha PTH e atisa ho etsoa e kholoanyane ho feta vias 'me e sebelisoa e le lesoba le pota-potiloeng bakeng sa ho amoheloa ha likaroloana - tse kang li-resistors tse seng tsa SMT, li-capacitor, le DIP sephutheloana sa IC.PTH e ka boela ea sebelisoa e le masoba bakeng sa ho hokahanya ha mochine ha vias e ka 'na ea se ke ea e-ba teng.
The plating holim'a likoti ke koporo, conductor, kahoo e lumella conductivity ea motlakase ho tsamaea ka boto.Li-non-plated ka likoti ha li na conductivity, kahoo haeba u li sebelisa, u ka ba le lipina tse molemo tsa koporo ka lehlakoreng le leng la boto.
Ho na le mefuta ea 3 ea masoba ho PCB, Plated through Hole (PTH), Non-Plated through Hole (NPTH) le Via Holes, tsena ha lia lokela ho ferekanngoa le Slots kapa Cut-outs.
Ho tsoa maemong a IPC, ke +/-0.08mm bakeng sa pth, le +/-0.05mm bakeng sa npth.
