Custom 4-layer Black Soldermask PCB le BGA
Tlhaloso ea Sehlahisoa:
| Boitsebiso ba Motheo: | FR4 TG170+PI |
| Botenya ba PCB: | E thata: 1.8+/-10%mm, e tenyetseha: 0.2+/-0.03mm |
| Palo ea Lera: | 4L |
| Botenya ba Koporo: | 35um/25um/25um/35um |
| Kalafo ea Bokaholimo: | ENIG 2U” |
| Mask oa solder: | Botala bo benyang |
| Silkscreen: | Bosoeu |
| Mokhoa o Khethehileng: | Regid+flex |
Kopo
Hajoale, theknoloji ea BGA e se e sebelisoa haholo lefapheng la likhomphutha (khomphutha e nkehang, supercomputer, khomphutha ea sesole, khomphutha ea mehala), sebaka sa puisano (li-pagers, mehala e nkehang, li-modem), lebala la likoloi (balaoli ba fapaneng ba lienjine tsa makoloi, lihlahisoa tsa boithabiso ba likoloi) .E sebelisoa mefuteng e mengata e fapaneng ea lisebelisoa tse sa sebetseng, tse atileng haholo ke li-arrays, marang-rang le likhokahano.Lisebelisoa tsa eona tse ikhethileng li kenyelletsa walkie-talkie, sebapali, kh'amera ea dijithale le PDA, jj.
FAQs
Li-BGA (Ball Grid Arrays) ke likarolo tsa SMD tse nang le likhokahano tse tlase ho karolo.Pini e 'ngoe le e' ngoe e fanoa ka bolo ea solder.Lihokelo tsohle li ajoa ka gridi e ts'oanang ea bokaholimo kapa matrix ho karolo.
Liboto tsa BGA li na le likhokahano tse ngata ho feta li-PCB tse tloaelehileng, e lumellang hore ho be le li-PCB tsa boholo bo boholo, tse nyenyane.Kaha lithakhisa li ka tlas'a boto, li-lead li boetse li khuts'oane, li fana ka conductivity e ntle le ts'ebetso e potlakileng ea sesebelisoa.
Likarolo tsa BGA li na le thepa eo li tla ikamahanya le eona ha solder e nolofatsa 'me e thatafala e thusang ka ho beoa ho sa phethahalang..Karolo e ka nako eo halefile ho amahanya le isang ho PCB.Thaba e ka sebelisoa ho boloka boemo ba karolo haeba soldering e etsoa ka letsoho.
Liphutheloana tsa BGA li fanamatla a pini a phahameng, khanyetso e tlase ea mocheso, le inductance e tlaseho feta mefuta e meng ea liphutheloana.Sena se bolela likhokahano tse ngata tsa khokahanyo le ts'ebetso e eketsehileng ka lebelo le phahameng ha e bapisoa le liphutheloana tse peli tsa mohala kapa tse bataletseng.Leha ho le joalo, BGA ha e na mefokolo ea eona.
Li-IC tsa BGA liho thata ho hlahloba ka baka la dithako tse patiloeng tlasa sephutheloana kapa mmele wa IC.Kahoo tlhahlobo ea pono ha e khonehe, 'me ho thata ho etsa soldering.The BGA IC solder joint with PCB pad ba sekametse ho flexural stress le mokhathala o bakoang ke ho futhumatsa mokhoa oa ho reflow soldering.
Bokamoso ba BGA Package ea PCB
Ka lebaka la mabaka a theko e tlase le ho tšoarella nako e telele, liphutheloana tsa BGA li tla tsebahala haholoanyane 'marakeng oa lihlahisoa tsa motlakase le tsa elektroniki nakong e tlang.Ho feta moo, ho na le mefuta e mengata e fapaneng ea liphutheloana tsa BGA li ile tsa ntlafatsoa ho finyella litlhoko tse fapaneng ho indasteri ea PCB, 'me ho na le melemo e mengata e meholo ka ho sebelisa theknoloji ena, kahoo re ka lebella bokamoso bo khanyang ka ho sebelisa sephutheloana sa BGA, haeba o na le tlhoko, ka kopo ikutloe u lokolohile ho ikopanya le rona.
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